PackageTFBGA
Current30mA
MountingSurface Mount
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Technical Specifications
Toshiba TC58NYG2S3EBAI5 technical specifications.
General
Address Bus Width
1b
Package/Case
TFBGA
Density
4Gb
Interface
Serial
Max Operating Temperature
85°C
Max Supply Voltage
1.95V
Memory Type
NAND,
Min Operating Temperature
-40°C
Min Supply Voltage
1.7V
Mount
Surface Mount
Operating Supply Voltage
1.8V
Radiation Hardening
No
RoHS Compliant
No
Supply Current
30mA
Sync/Async
Synchronous
Word Size
8b
Compliance
RoHS
Not CompliantNo
Datasheet
Toshiba TC58NYG2S3EBAI5 Datasheet
Download the complete datasheet for Toshiba TC58NYG2S3EBAI5 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.