PackageSSOP
MountingSurface Mount
Quick Jump:
Technical Specifications
Toshiba TG2006F(T2LMDNSIK) technical specifications.
General
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Pin Count
8
PCB
8
Package Length (mm)
2.9
Package Width (mm)
2.8
Package Height (mm)
1.1
Pin Pitch (mm)
0.65
Mounting
Surface Mount
Manufacturer Type
Power Amplifier
Number of Channels per Chip
1
Typical Output Power Range
20 to 30dBm
Maximum Operating Frequency
1900MHz
Typical Power Gain
22@1900MHzdB
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TG2006F(T2LMDNSIK) Datasheet
Download the complete datasheet for Toshiba TG2006F(T2LMDNSIK) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.