PackageVFBGA
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Technical Specifications
Toshiba TH58BYG2S3HBAI6 technical specifications.
General
| Package/Case | VFBGA |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Memory Type | EEPROM, NAND |
| Min Operating Temperature | -40°C |
| Packaging | Tray |
| RoHS Compliant | No |
| Series | Benand™ |
Compliance
| RoHS | Not Compliant |
Datasheet
Toshiba TH58BYG2S3HBAI6 Datasheet
Download the complete datasheet for Toshiba TH58BYG2S3HBAI6 to view detailed technical specifications.
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