Surface mount optocoupler featuring a single-channel DC input and DC output with a transistor and base. This 5-pin MFSOP package offers 3750 Vrms isolation, a minimum current transfer ratio of 20%, and operates within a -55°C to 100°C temperature range. The gull-wing lead-frame design facilitates efficient surface mounting, with package dimensions of 3.6mm x 4.4mm x 2.5mm and a 1.27mm pin pitch. Maximum specifications include 1.72V forward voltage, 8mA collector current, and 5V reverse voltage, with a power dissipation of 100mW.
PackageMFSOP
MountingSurface Mount
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Technical Specifications
Toshiba TLP114A(IGM-TPL) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package/Case | MFSOP |
| Lead Shape | Gull-wing |
| Pin Count | 5 |
| PCB | 5 |
| Package Length (mm) | 3.6 |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 2.5 |
| Seated Plane Height (mm) | 2.6 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Output Type | DC |
| Input Type | DC |
| Output Device | Transistor With Base |
| Number of Channels per Chip | 1 |
| Minimum Isolation Voltage | 3750Vrms |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 100°C |
| Minimum Current Transfer Ratio | 20% |
| Maximum Forward Voltage | 1.72V |
| Maximum Collector Current | 8mA |
| Maximum Power Dissipation | 100mW |
| Maximum Reverse Voltage | 5V |
Compliance
| Cage Code | S0562 |
| HTS Code | 8541408000 |
| Schedule B | 8541408000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TLP114A(IGM-TPL) Datasheet
Download the complete datasheet for Toshiba TLP114A(IGM-TPL) to view detailed technical specifications.
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