1-channel DC input optocoupler with transistor DC output, featuring a 4-pin MFSOP surface-mount package. Offers 3750 Vrms isolation voltage and operates within a -25°C to 110°C temperature range. Key specifications include a minimum current transfer ratio of 100%, maximum collector-emitter voltage of 80V, and maximum collector current of 50mA. The lead-frame SMT package has gull-wing leads, a 2.54mm pin pitch, and dimensions of 3.6mm (L) x 4.4mm (W) x 2.5mm (H).
PackageMFSOP
MountingSurface Mount
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Technical Specifications
Toshiba TLP181(TEE-GB-TPLS) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package/Case | MFSOP |
| Lead Shape | Gull-wing |
| Pin Count | 4 |
| PCB | 4 |
| Package Length (mm) | 3.6 |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 2.5 |
| Seated Plane Height (mm) | 2.6 |
| Pin Pitch (mm) | 2.54 |
| Package Weight (g) | 0.09 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Output Type | DC |
| Input Type | DC |
| Output Device | Transistor |
| Number of Channels per Chip | 1 |
| Minimum Isolation Voltage | 3750Vrms |
| Min Operating Temperature | -25°C |
| Max Operating Temperature | 110°C |
| Minimum Current Transfer Ratio | 100% |
| Maximum Forward Voltage | 1.3V |
| Maximum Collector-Emitter Voltage | 80V |
| Maximum Current Transfer Ratio | 600% |
| Maximum Collector Current | 50mA |
| Maximum Collector-Emitter Saturation Voltage | 400mV |
| Maximum Power Dissipation | 200mW |
| Maximum Reverse Voltage | 5V |
Compliance
| Cage Code | S0562 |
| HTS Code | 8541408000 |
| Schedule B | 8541408000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Toshiba TLP181(TEE-GB-TPLS) Datasheet
Download the complete datasheet for Toshiba TLP181(TEE-GB-TPLS) to view detailed technical specifications.
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