PackageMFSOP
MountingSurface Mount
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Technical Specifications
Toshiba TLP190B(U,F) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package/Case
MFSOP
Lead Shape
Gull-wing
Pin Count
4
PCB
4
Package Length (mm)
3.6
Package Width (mm)
4.4
Package Height (mm)
2.5
Seated Plane Height (mm)
2.6
Pin Pitch (mm)
2.54
Package Weight (g)
0.09
Package Material
Plastic
Mounting
Surface Mount
Output Type
DC
Input Type
DC
Output Device
Linear Photovoltaic
Number of Channels per Chip
1
Minimum Isolation Voltage
2500Vrms
Min Operating Temperature
-25°C
Max Operating Temperature
85°C
Maximum Forward Voltage
1.7V
Maximum Reverse Voltage
3V
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8541408000
Schedule B
8541408000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TLP190B(U,F) Datasheet
Download the complete datasheet for Toshiba TLP190B(U,F) to view detailed technical specifications.
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