PackageSMD/SMT
MountingSurface Mount
Power60mW
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Technical Specifications
Toshiba TLP2768(TP,F) technical specifications.
General
| Package/Case | SMD/SMT |
| Direction | Unidirectional |
| Fall Time | 0.03us |
| Forward Current | 25mA |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 60mW |
| Mount | Surface Mount |
| Number of Elements | 1 |
| Output Current | 25mA |
| Packaging | Tape and Reel |
| Power Dissipation | 60mW |
| Propagation Delay | 60ns |
| Radiation Hardening | No |
| Reverse Breakdown Voltage | 5V |
| RoHS Compliant | Yes |
| Turn-On Delay Time | 60ns |
Compliance
| RoHS | Compliant |
Datasheet
Toshiba TLP2768(TP,F) Datasheet
Download the complete datasheet for Toshiba TLP2768(TP,F) to view detailed technical specifications.
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