PackagePDIP
MountingThrough Hole
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Technical Specifications
Toshiba TLP3063F(S,C,F,T) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
5
PCB
5
Package Length (mm)
7.12
Package Width (mm)
6.4
Package Height (mm)
3.65
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Output Device
Triac
Number of Channels per Chip
1
Zero-Crossing Circuit
Yes
Minimum Isolation Voltage
5000Vrms
Output Type
AC
Repetitive Peak Off-State Voltage
600(Min)V
Minimum Trigger Current
5(Max)mA
Maximum Continuous Output Current
100mA
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8541408000
Schedule B
8541408000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TLP3063F(S,C,F,T) Datasheet
Download the complete datasheet for Toshiba TLP3063F(S,C,F,T) to view detailed technical specifications.
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