PackagePDIP SMD
MountingSurface Mount
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Technical Specifications
Toshiba TLP421F(KMT3-TP4) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
DIP
Package/Case
PDIP SMD
Package Description
Surface Mount Plastic Dual In Line Package
Lead Shape
Gull-wing
Pin Count
4
PCB
4
Package Length (mm)
4.58
Package Width (mm)
6.4
Package Height (mm)
3.65
Seated Plane Height (mm)
3.9
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Surface Mount
Output Type
DC
Input Type
DC
Output Device
Transistor
Number of Channels per Chip
1
Minimum Isolation Voltage
5000Vrms
Minimum Current Transfer Ratio
50%
Maximum Collector-Emitter Voltage
80(Min)V
Compliance
Cage Code
S0562
HTS Code
8541408000
Schedule B
8541408000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TLP421F(KMT3-TP4) Datasheet
Download the complete datasheet for Toshiba TLP421F(KMT3-TP4) to view detailed technical specifications.
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