PackageSDIP SMD
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Toshiba TLP706(D4-TP,F) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
DIP
Package/Case
SDIP SMD
Lead Shape
Gull-wing
Pin Count
6
PCB
6
Package Length (mm)
4.58
Package Width (mm)
6.8
Package Height (mm)
3.65
Seated Plane Height (mm)
4
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Input Type
DC
Output Type
Totem-Pole
Number of Channels per Chip
1
Polarity
Non-Inverting
Direction Type
Uni-Directional
Minimum Isolation Voltage
5000Vrms
Logic Gate Type
AND Schmitt
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Maximum Forward Current
20mA
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8541408000
Schedule B
8541408000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TLP706(D4-TP,F) Datasheet
Download the complete datasheet for Toshiba TLP706(D4-TP,F) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.