High-speed logic output optocoupler featuring a single channel with a totem-pole output and DC input. This surface mount device is housed in a 6-pin SDIP SMD package with gull-wing leads, offering a minimum isolation voltage of 5000 Vrms. The optocoupler utilizes a NAND Schmitt logic gate type and operates unidirectionally with an inverting polarity. Key package dimensions include a length of 4.58mm, width of 6.8mm, and height of 3.65mm, with a pin pitch of 1.27mm. Operating temperature range is from -40°C to 100°C, with a maximum forward current of 10mA.
PackageSDIP SMD
MountingSurface Mount
PolarityInverting
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Technical Specifications
Toshiba TLP718(TP,F) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
DIP
Package/Case
SDIP SMD
Package Description
Surface Mount Plastic Dual In Line Package
Lead Shape
Gull-wing
Pin Count
6
PCB
6
Package Length (mm)
4.58
Package Width (mm)
6.8
Package Height (mm)
3.65
Seated Plane Height (mm)
4
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Input Type
DC
Output Type
Totem-Pole
Number of Channels per Chip
1
Polarity
Inverting
Direction Type
Uni-Directional
Minimum Isolation Voltage
5000Vrms
Logic Gate Type
NAND Schmitt
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Maximum Forward Current
10mA
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8541408000
Schedule B
8541408000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TLP718(TP,F) Datasheet
Download the complete datasheet for Toshiba TLP718(TP,F) to view detailed technical specifications.
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