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Technical Specifications
Toshiba TLP722(D4MATTP1,F technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | DIP |
| Package/Case | PDIP SMD |
| Package Description | Surface Mount Plastic Dual In Line Package |
| Lead Shape | Gull-wing |
| Pin Count | 4 |
| PCB | 4 |
| Package Length (mm) | 4.58 |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 3.65 |
| Seated Plane Height (mm) | 4 |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Output Type | DC |
| Input Type | DC |
| Output Device | Photovoltaic |
| Number of Channels per Chip | 1 |
| Minimum Isolation Voltage | 4000Vrms |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 100°C |
| Maximum Forward Voltage | 1.85V |
| Maximum Reverse Voltage | 5V |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8541408000 |
| Schedule B | 8541408000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Toshiba TLP722(D4MATTP1,F Datasheet
Download the complete datasheet for Toshiba TLP722(D4MATTP1,F to view detailed technical specifications.
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