PackagePDIP SMD
MountingSurface Mount
Quick Jump:
Technical Specifications
Toshiba TLP759(D4-LF1,F) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
DIP
Package/Case
PDIP SMD
Package Description
Surface Mount Plastic Dual In Line Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
9.66
Package Width (mm)
6.4
Package Height (mm)
3.65
Seated Plane Height (mm)
4
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-001BA
Output Type
DC
Input Type
DC
Output Device
Transistor With Base
Number of Channels per Chip
1
Minimum Isolation Voltage
5000Vrms
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8541408000
Schedule B
8541408000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TLP759(D4-LF1,F) Datasheet
Download the complete datasheet for Toshiba TLP759(D4-LF1,F) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.