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Technical Specifications
Toshiba TLP759(LF2,F) technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | PDIP |
| Package Description | Plastic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 9.66 |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 3.65 |
| Seated Plane Height (mm) | 4.45 |
| Pin Pitch (mm) | 2.54 |
| Package Weight (g) | 0.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Output Type | DC |
| Input Type | DC |
| Output Device | Transistor With Base |
| Number of Channels per Chip | 1 |
| Minimum Isolation Voltage | 5000Vrms |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8541408000 |
| Schedule B | 8541408000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Toshiba TLP759(LF2,F) Datasheet
Download the complete datasheet for Toshiba TLP759(LF2,F) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.