Passive pin fin array heat sink designed for BGA packages. Features omnidirectional airflow with a natural thermal resistance of 3°C/W and 3°C/W at 100 LFM forced air. Constructed from anodized aluminum with a black finish, this square-shaped heat sink measures 27.9mm in length and width, with a height of 8.89mm. Mounts via adhesive and is RoHS compliant.
PackageBGA
MountingAdhesive
Quick Jump:
Technical Specifications
Wakefield 658-35AB technical specifications.
General
Package/Case
BGA
Color
Black
Finish
Anodized
Height
8.89mm
Lead Free
Lead Free
Length
27.9mm
Material
Aluminium, Anodized
Mount
Adhesive
Natural Thermal Resistance
3°C/W
Package Cooled
BGA
Packaging
Bulk
Reach SVHC Compliant
No
RoHS Compliant
Yes
Series
658
Shape
Square, Fins
Thermal Resistance @ Forced Air Flow (100 LFM)
3°C/W
Type
Passive
Width
27.9mm
Compliance
RoHS
Compliant
Datasheet
Wakefield 658-35AB Datasheet
Download the complete datasheet for Wakefield 658-35AB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.