Passive pin fin array heat sink designed for BGA packages. Features omnidirectional airflow with a natural thermal resistance of 3°C/W and 3°C/W at 100 LFM forced air. Constructed from anodized aluminum with a black finish, this square-shaped heat sink measures 27.9mm in length and width, with a height of 8.89mm. Mounts via adhesive and is RoHS compliant.
PackageBGA
MountingAdhesive
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Technical Specifications
Wakefield 658-35AB technical specifications.
General
| Package/Case | BGA |
| Color | Black |
| Finish | Anodized |
| Height | 8.89mm |
| Lead Free | Lead Free |
| Length | 27.9mm |
| Material | Aluminium, Anodized |
| Mount | Adhesive |
| Natural Thermal Resistance | 3°C/W |
| Package Cooled | BGA |
| Packaging | Bulk |
| Reach SVHC Compliant | No |
| RoHS Compliant | Yes |
| Series | 658 |
| Shape | Square, Fins |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 3°C/W |
| Type | Passive |
| Width | 27.9mm |
Compliance
| RoHS | Compliant |
Datasheet
Wakefield 658-35AB Datasheet
Download the complete datasheet for Wakefield 658-35AB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.