Omnidirectional pin fin heat sink, designed for 27mm BGA packages. Features anodized aluminum construction with a black finish. Offers a natural thermal resistance of 2°C/W and 2°C/W at 100 LFM forced air flow. Mounts via adhesive. Dimensions are 27.9mm length and width, with a 15.2mm height. Lead-free compliant.
PackageBGA
MountingAdhesive
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Technical Specifications
Wakefield 658-60ABT1E technical specifications.
General
| Package/Case | BGA |
| Color | Black |
| Finish | Anodized |
| Height | 15.2mm |
| Lead Free | Lead Free |
| Length | 27.9mm |
| Material | Aluminium |
| Mount | Adhesive |
| Natural Thermal Resistance | 2°C/W |
| Package Cooled | BGA |
| Series | 658 |
| Shape | Square, Fins |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 2°C/W |
| Width | 27.9mm |
Compliance
| RoHS | Compliant |
Datasheet
Wakefield 658-60ABT1E Datasheet
Download the complete datasheet for Wakefield 658-60ABT1E to view detailed technical specifications.
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