MountingSurface Mount
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Technical Specifications
Winbond W25Q256FVEIG/TRAY technical specifications.
General
| Access Time | 8.5ns |
| Address Bus Width | 1b |
| Density | 256Mb |
| Interface | SPI, Serial |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 2.7V |
| Mount | Surface Mount |
| Nominal Supply Current | 20mA |
| Operating Supply Voltage | 3.3V |
| Sync/Async | Synchronous |
| Word Size | 8b |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W25Q256FVEIG/TRAY Datasheet
Download the complete datasheet for Winbond W25Q256FVEIG/TRAY to view detailed technical specifications.
No datasheet is available for this part.