The W25Q64DWSSIG/TRAY is a 64Mb SPI serial flash memory from Winbond. It features an access time of 7ns and operates within a temperature range of -40°C to 85°C. The device is available in a SOIC package and is designed for surface mount applications. It supports a maximum supply voltage of 1.95V and a minimum supply voltage of 1.7V, with a nominal supply current of 40mA. The W25Q64DWSSIG/TRAY is a synchronous device with an 8-bit word size and supports SPI and serial interfaces.
PackageSOIC
MountingSurface Mount
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Technical Specifications
Winbond W25Q64DWSSIG/TRAY technical specifications.
General
| Access Time | 7ns |
| Address Bus Width | 1b |
| Package/Case | SOIC |
| Density | 64Mb |
| Interface | SPI, Serial |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 1.95V |
| Min Supply Voltage | 1.7V |
| Mount | Surface Mount |
| Nominal Supply Current | 40mA |
| Operating Supply Voltage | 1.8V |
| Sync/Async | Synchronous |
| Word Size | 8b |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W25Q64DWSSIG/TRAY Datasheet
Download the complete datasheet for Winbond W25Q64DWSSIG/TRAY to view detailed technical specifications.
No datasheet is available for this part.