Winbond
W25X40CLSSIG/TRAY
NOR Flash Serial (SPI, Dual SPI) 2.5V/3V/3.3V 4M-bit 512K x 8 8ns 8-Pin SOIC
PackageSOIC
MountingSurface Mount
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Technical Specifications
Winbond W25X40CLSSIG/TRAY technical specifications.
General
| Access Time | 8ns |
| Address Bus Width | 1b |
| Package/Case | SOIC |
| Density | 4Mb |
| Interface | SPI, Serial |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 2.3V |
| Mount | Surface Mount |
| Nominal Supply Current | 14mA |
| Number of Words | 512000 |
| Sync/Async | Synchronous |
| Word Size | 8b |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W25X40CLSSIG/TRAY Datasheet
Download the complete datasheet for Winbond W25X40CLSSIG/TRAY to view detailed technical specifications.
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