Winchester Interconnect
M55302/58LE56Y-2
56-Contact Shrouded RCP Wire to Board Header, 2 Rows, 1.27mm Pitch, Through Hole Mount
The M55302/58LE56Y-2 is a wire to board header from Winchester Interconnect. It features 56 RCP contacts in a 2-row shrouded configuration with a terminal pitch of 1.27mm. The header is designed for through hole mounting and has a maximum operating temperature range of -55°C to 125°C. It can withstand a maximum voltage rating of 750VAC and a maximum current rating of 5A.
MountingThrough Hole
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Technical Specifications
Winchester Interconnect M55302/58LE56Y-2 technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 56 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Max Voltage Rating | 750VAC |
| Height | 8.51mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Winchester Interconnect M55302/58LE56Y-2 Datasheet
Download the complete datasheet for Winchester Interconnect M55302/58LE56Y-2 to view detailed technical specifications.
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