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The Rise of Open Hardware

- www.eetimes.com

The democratization of hardware design may be upon us.

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Live Coverage of CES 2021

- www.eetimes.com

Return here often the week of January 10 to find up-to-the-minute coverage of this year’s CES 2021. This is where we’ll collect our news and product stories, from EE Times as well as from our sister Aspencore publications.

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Advanced IC Packaging: Fundamentals For the ‘More Than Moore’ Era

- www.eetimes.com

Process engineers need to understand next-generation packaging technologies as back-end engineers fashion extremely dense IC packages.

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Protecting the Industrial Cloud from Cyberattacks

- www.eetimes.com

The cloud and edge computing have come to the industrial world and they’re here to stay. Whether one thinks that’s a good or bad thing, it’s now inevitable. These shifts have been accelerated by the enormous expansion in remote workers due to Covid-19 and their many unmanaged or insecurely managed devices, along with the connection […]

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How Best to Hone Vehicle Senses

- www.eetimes.com

What does it take to improve vehicle senses — to make cars see better? Multiple sensing modalities, a better in-vehicle network, a common sense layer, and a lot more.

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The Memory Market

- www.eetimes.com

Our Special Project on the memory market examines how demand for both legacy ICs and so-called emerging memories is being affected by the growth of new applications.

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How are design engineers responding to Covid-19?

- www.electronicproducts.com

Here are real design solutions related to diagnostics, treatment, surveillance, and prevention of the spread of Covid-19.

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Covid-19 Tech Diary: Design Specs for Tackling The Pandemic

- www.eetimes.com

Has the electronics industry done enough tackling the pandemic? The spread of the virus has renewed calls for technology innovation.

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The New Tech Cold War

- www.eetimes.com

The world is dividing into Chinese and western technology camps. It’s a tech cold war.

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GaN, SiC Offer a Power Electronics Alternative

- www.eetimes.com

Wide bandgap materials may be posed to replace silicon, as a power electronics alternative, for low-power, high-frequency applications.

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Intelligence at Hyper-Scale

- www.eetimes.com

We examine the technologies and increasingly AI-driven applications that are reshaping the data center.

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ASPENCORE全球网站
EEtimes
值得全球电子界信赖的新闻渠道
eetimes.com
power electronics news
注重功耗的设计工程师可信赖的新闻来源
powerelectronicsnews.com
ebn
电子行业的供应链新闻
ebnonline.com