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overview概述

熟悉该组件的基本一般信息、属性和特征,以及其与行业标准和法规的符合情况。

lifeCycleinfo
EURohs
rohs unknown未知状态
RoHSVersion
2011/65/EU, 2015/863
autoMotive
rohs unknown未知状态
SupplierCageCodeinfo
6Z9Z3
HTSUSAinfo
8542310001
类别路径
Semiconductor > Microcontrollers and Processors > Processors > Microprocessors - MPUs

package封装

组件的包装信息提供了有关产品尺寸、重量和包装的重要细节。这有助于工程师确定产品是否符合其要求和期望。

Basic Package Type
infolock
Package Family Name
infolock
Supplier Package
infolock
Package Description
infolock
Lead Shape
infolock
Pin Count
infolock
PCB
infolock
Tabinfo
infolock
Package Length (mm)info
infolock
Package Width (mm)info
infolock
Package Height (mm)info
infolock
Seated Plane Height (mm)info
infolock
Pin Pitch (mm)info
infolock
Package Diameter (mm)
infolock
Package Weight (g)
infolock
Package Material
infolock
Mounting
infolock
Package Overall Height (mm)
infolock
Package Overall Width (mm)
infolock
Package Overall Length (mm)
infolock
Jedec
infolock

manufacturing制造

制造信息指定了生产和组装该组件的技术要求和规格。这些信息对于制造商来说至关重要,以保持组件的质量和可靠性,并确保其与其他设备和组件兼容。

MSLinfo
infolock
Maximum Reflow Temperature (°C)info
infolock
Reflow Solder Time (Sec)info
infolock
Number of Reflow Cycleinfo
infolock
Standardinfo
infolock
Reflow Temp. Source
infolock
Maximum Wave Temperature (°C)info
infolock
Wave Solder Time (Sec)info
infolock
Wave Temp. Source
infolock
Lead Finish(Plating)info
infolock
Under Plating Materialinfo
infolock
Terminal Base Materialinfo
infolock
216T9NGBGA13FHG (M9)

216T9NGBGA13FHG (M9)通过 Advanced Micro Devices, Inc.