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EME-G700H

描述:

Epoxy Resin Molding Compound for Encapsulation of Semiconductor Device

Updated: +90 days


查看更多Molding Compounds 属于 Sumitomo Bakelite Co., Ltd

在线版本: https://www.datasheets.com/zh-cn/part-details/eme-g700h-sumitomo-bakelite-co---ltd-425469786

overview概述

熟悉该组件的基本一般信息、属性和特征,以及其与行业标准和法规的符合情况。

lifeCycleinfo
ECCNinfo
EAR99
类别路径
Materials and Chemicals > Materials, Chemicals and Adhesives > Materials > Molding Compounds

pdf数据手册

通过下载该电子元件的数据手册来全面了解其。这个PDF文档包含了所有必要的细节,如产品概述、特性、规格、评级、图表、应用等等。

数据表预览

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parametric参数

参数信息显示了该组件的重要特性和性能指标,这有助于工程师和供应链经理比较和选择最适合其应用和需求的电子组件。

生产线
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Density
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Water Absorption
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Melt Mass Flow Rate
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Drying Temperature
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Drying Time
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Flexural Modulus @ 23C
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Notched Izod Impact @ 23C
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Notched Charpy Impact @ 23C
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Dielectric Strength
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Flow Molding Shrinkage
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Across Flow Molding Shrinkage
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Melt Temperature
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Molding Process
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Thermal Conductivity
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Flash Point
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VOC Content
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Odor
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Specific Gravity
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Form
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Color
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Material
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Filler
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Durometer
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Molding Temperature
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Minimum Shore Hardness
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Typical Shore Hardness
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Maximum Shore Hardness
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Viscosity
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Tensile Strength
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Elongation
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EME-G700H