升级为高级版
LM3S5P56-EBZ100-C0
描述: | MCU 32-bit ARM Cortex M3 RISC 64KB Flash 1.2V/3.3V 108-Pin NFBGA Tray |
厂商: | Texas Instruments |
推出日期: | Oct 9, 2009 |
最近更新日期: +90 | |
在线版本: https://www.datasheets.com/zh-cn/part-details/lm3s5p56-ebz100-c0-texas-instruments-40706001
概述
概述熟悉该组件的基本一般信息、属性和特征，以及其与行业标准和法规的符合情况。
lifeCycle
EURohs
未知状态RoHSVersion
2002/95/EC
autoMotive
不是SupplierCageCode
01295
HTSUSA
8542310001
SCHDULEB
8542310000
RadHard
不是DoseLevel
N/A
PPAP
不是分类路径
Semiconductor > Microcontrollers and Processors > Microcontrollers > Microcontrollers - MCUs
Semiconductor > Microcontrollers and Processors > Microcontrollers > Microcontrollers - MCUs
数据手册
数据手册通过下载该电子元件的数据手册来全面了解其。这个PDF文档包含了所有必要的细节，如产品概述、特性、规格、评级、图表、应用等等。
修订日期:
数据表预览
封装
封装组件的包装信息提供了有关产品尺寸、重量和包装的重要细节。这有助于工程师确定产品是否符合其要求和期望。
您必须登录才能查看受限信息。
Basic Package Type
Package Family Name
Supplier Package
Package Description
Lead Shape
Pin Count
PCB
Tab
Package Length (mm)
Package Width (mm)
Package Height (mm)
Seated Plane Height (mm)
Pin Pitch (mm)
Package Diameter (mm)
Package Weight (g)
Package Material
Mounting
Package Outline
Package Overall Height (mm)
Package Overall Width (mm)
Package Overall Length (mm)
Jedec
制造
制造制造信息指定了生产和组装该组件的技术要求和规格。这些信息对于制造商来说至关重要，以保持组件的质量和可靠性，并确保其与其他设备和组件兼容。
您必须登录才能查看受限信息。
MSL
Maximum Reflow Temperature (°C)
Reflow Solder Time (Sec)
Reflow Temp. Source
Maximum Wave Temperature (°C)
Wave Solder Time (Sec)
Lead Finish(Plating)
Under Plating Material
Terminal Base Material
参数
参数参数信息显示了该组件的重要特性和性能指标，这有助于工程师和供应链经理比较和选择最适合其应用和需求的电子组件。
您必须登录才能查看受限信息。
生产线
Maximum Expanded Memory Size
Operating Supply Voltage
Supplier Temperature Grade
Maximum Storage Temperature
Minimum Storage Temperature
Temperature Flag
Parallel Master Port
Real Time Clock
Timers Channels
Special Features
LCD Segments
Display Driver
Maximum Power Dissipation
Data Memory Size
Analog Comparators
Watchdog
PWM
Ethernet Interface Type
Ethernet Speed
Solutions
ISM Band
Touch Sensing Interface
Power On Reset
Memory Protection Unit
Temperature Sensor
DDR
Memory Management Unit
Integrated Development Environment
Super Scalar
External Bus Interface
Hardware Acceleration
Trace Hardware
Maximum Dhrystone MIPS
Encryption Standard
DMA Channels
CAN Type
EEPROM
Instruction Cache Size
Data Cache Size
Multiply Accumulate
Input Capture Channels
Output Compare Channels
Internal/External Clock Type
Timers Resolution
Direct Memory Access
Floating Point Unit
Bluetooth
Wi-Fi
Tradename
Process Technology
Number of Cores
LIN
Family Name
Core Architecture
Device Core
Data Bus Width
Instruction Set Architecture
Maximum Clock Rate
Maximum CPU Frequency
Program Memory Type
Program Memory Size
RAM Size
Number of ADCs
ADC Channels
ADC Resolution
Number of DACs
DAC Channels
DAC Resolution
Number of Timers
Number of Programmable I/Os
Minimum Operating Supply Voltage
Typical Operating Supply Voltage
Maximum Operating Supply Voltage
Interface Type
CAN
I2C
SPI
Ethernet
UART
USART
USB
I2S
Programmability
Minimum Operating Temperature
Maximum Operating Temperature
