LM3S5P56-EBZ100-C0

LM3S5P56-EBZ100-C0

Texas Instruments
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描述:

MCU 32-bit ARM Cortex M3 RISC 64KB Flash 1.2V/3.3V 108-Pin NFBGA Tray

推出日期:

Oct 9, 2009

更新: +90 天


查看更多Microcontrollers - MCUs 属于 Texas Instruments

在线版本: https://www.datasheets.com/zh-cn/part-details/lm3s5p56-ebz100-c0-texas-instruments-40706001

overview概述

熟悉该组件的基本一般信息、属性和特征,以及其与行业标准和法规的符合情况。

lifeCycleinfo
EURohs
rohs unknown未知状态
RoHSVersion
2002/95/EC
autoMotive
no不是
SupplierCageCodeinfo
01295
HTSUSAinfo
8542310001
SCHDULEBinfo
8542310025
PPAP
no不是
类别路径
Semiconductor > Microcontrollers and Processors > Microcontrollers > Microcontrollers - MCUs

pdf数据手册

通过下载该电子元件的数据手册来全面了解其。这个PDF文档包含了所有必要的细节,如产品概述、特性、规格、评级、图表、应用等等。

数据表预览

(Latest 版本)

选择版本:

package封装

组件的包装信息提供了有关产品尺寸、重量和包装的重要细节。这有助于工程师确定产品是否符合其要求和期望。

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Seated Plane Height (mm)info
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Pin Pitch (mm)info
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Package Diameter (mm)
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Package Weight (g)
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Package Material
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Mounting
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Package Outline
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Package Overall Height (mm)
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Package Overall Width (mm)
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Package Overall Length (mm)
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Jedec
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manufacturing制造

制造信息指定了生产和组装该组件的技术要求和规格。这些信息对于制造商来说至关重要,以保持组件的质量和可靠性,并确保其与其他设备和组件兼容。

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametric参数

参数信息显示了该组件的重要特性和性能指标,这有助于工程师和供应链经理比较和选择最适合其应用和需求的电子组件。

生产线
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Maximum Expanded Memory Size
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Operating Supply Voltage
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Supplier Temperature Grade
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Minimum Storage Temperature
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Parallel Master Port
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Real Time Clock
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Timers Channels
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Maximum Storage Temperature
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Temperature Flag
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Special Features
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Maximum Power Dissipation
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Display Driver
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Data Memory Size
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Analog Comparators
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Watchdog
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PWM
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LCD Segments
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Hardware Acceleration
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Trace Hardware
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Maximum Dhrystone MIPS
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Encryption Standard
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DMA Channels
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CAN Type
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EEPROM
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Instruction Cache Size
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Data Cache Size
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Direct Memory Access
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Floating Point Unit
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Bluetooth
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Wi-Fi
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Timers Resolution
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Multiply Accumulate
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Input Capture Channels
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Output Compare Channels
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Internal/External Clock Type
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Touch Sensing Interface
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Power On Reset
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Memory Protection Unit
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Temperature Sensor
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DDR
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Memory Management Unit
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Integrated Development Environment
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Super Scalar
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External Bus Interface
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Solutions
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ISM Band
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Ethernet Interface Type
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Ethernet Speed
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Process Technology
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Tradename
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LIN
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Number of Cores
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Family Name
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Core Architecture
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Device Core
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Data Bus Width
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Instruction Set Architecture
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Maximum Clock Rate
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Maximum CPU Frequency
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Program Memory Type
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Program Memory Size
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RAM Size
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Number of ADCs
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ADC Channels
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ADC Resolution
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Number of DACs
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DAC Channels
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DAC Resolution
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Number of Timers
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Number of Programmable I/Os
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Minimum Operating Supply Voltage
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Typical Operating Supply Voltage
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Maximum Operating Supply Voltage
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Interface Type
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CAN
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I2C
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SPI
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Ethernet
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UART
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USART
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USB
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I2S
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Programmability
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Minimum Operating Temperature
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Maximum Operating Temperature
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processor替代型号

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LM3S5P56-EBZ100-C0

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