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MCP607-I/P

描述:

Op Amp Dual Micropower Amplifier R-R O/P 6V Automotive AEC-Q100 8-Pin PDIP Tube

产地:

Thailand

推出日期:

Jun 28, 2012

更新: 19-APR-2024


查看更多Operational Amplifiers - Op Amps 属于 Microchip Technology

在线版本: https://www.datasheets.com/zh-cn/part-details/mcp607-i-p-microchip-technology-17213851

overview概述

熟悉该组件的基本一般信息、属性和特征,以及其与行业标准和法规的符合情况。

lifeCycleinfo
EURohs
rohs yes
RoHSVersion
2011/65/EU, 2015/863
ECCNinfo
EAR99
autoMotive
yesYes
SupplierCageCodeinfo
60991
HTSUSAinfo
8542330001
SCHDULEBinfo
8542330000
PPAP
yesYes
aecQualified
yesYes
类别路径
Semiconductor > Linear > Amplifiers > Operational Amplifiers - Op Amps

pdf数据手册

通过下载该电子元件的数据手册来全面了解其。这个PDF文档包含了所有必要的细节,如产品概述、特性、规格、评级、图表、应用等等。

数据表预览

(Latest 版本)

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授权经销商

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其他经销商

Future Electronics
Future Electronics
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Weisbauer Elektronik GmbH
Weisbauer Elektronik GmbH
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Allied Electronics
Allied Electronics
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Chip1Stop
Chip1Stop
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Onlinecomponents.com
Onlinecomponents.com
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package封装

组件的包装信息提供了有关产品尺寸、重量和包装的重要细节。这有助于工程师确定产品是否符合其要求和期望。

Basic Package Type
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Package Family Name
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Supplier Package
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Package Description
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Lead Shape
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Pin Count
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PCB
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Tabinfo
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Package Length (mm)info
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Package Width (mm)info
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Package Height (mm)info
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Package Diameter (mm)
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Mounting
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Package Outline
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Jedec
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Jedec info (PKG outline)
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manufacturing制造

制造信息指定了生产和组装该组件的技术要求和规格。这些信息对于制造商来说至关重要,以保持组件的质量和可靠性,并确保其与其他设备和组件兼容。

MSLinfo
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Maximum Reflow Temperature (°C)info
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Reflow Solder Time (Sec)info
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Reflow Temp. Source
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Maximum Wave Temperature (°C)info
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Wave Solder Time (Sec)info
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Wave Temp. Source
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Lead Finish(Plating)info
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Under Plating Materialinfo
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Terminal Base Materialinfo
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parametric参数

参数信息显示了该组件的重要特性和性能指标,这有助于工程师和供应链经理比较和选择最适合其应用和需求的电子组件。

生产线
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Maximum Input Voltage Range
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Typical Input Resistance
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Maximum Quiescent Current
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Maximum Storage Temperature
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Minimum CMRR Range
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Typical Voltage Gain
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Supplier Temperature Grade
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Typical Inverting Input Current Noise Density
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Typical Noninverting Input Current Noise Density
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Typical Slew Rate
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Typical Input Noise Voltage Density
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Typical Settling Time
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Shut Down Support
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Power Supply Type
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Maximum Power Dissipation
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Typical Output Resistance
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Typical High Level Output Voltage
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Input Offset Voltage Drift
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Typical Input Bias Current
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Typical Input Offset Current
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Minimum Storage Temperature
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Manufacturer Type
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类型
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Number of Channels per Chip
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Rail to Rail
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Output Type
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Minimum Slew Rate
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Typical Gain Bandwidth Product
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Typical Low Level Output Voltage
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Maximum Input Bias Current
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Maximum Input Offset Voltage
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Maximum Supply Current
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Typical Output Current
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Minimum Single Supply Voltage
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Maximum Single Supply Voltage
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Minimum Dual Supply Voltage
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Maximum Dual Supply Voltage
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Minimum CMRR
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Minimum PSRR
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Minimum Operating Temperature
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Maximum Operating Temperature
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Maximum Input Offset Current
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Maximum Operating Supply Voltage
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Typical Dual Supply Voltage
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Typical Single Supply Voltage
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Maximum Supply Voltage Range
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Process Technology
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electrical circuit参考设计

通过我们的参考设计解锁灵感和指导,探索展示电子组件能力的实用实现。通过详细文档和原理图加速开发过程,创建高效的解决方案。

CADsCAD模型

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MCP607-I/P

MCP607-I/P通过 Microchip Technology