升級為高級版
KLM8G1GEUF-B04P
描述: | High-Performance eMMC Flash |
廠商: | Samsung Electronics |
推出日期: | Jul 21, 2020 |
最後更新日期: 22 NOV 2023 | |
線上版本: https://www.datasheets.com/zh-tw/part-details/klm8g1geuf-b04p-samsung-electronics-416262465
概述
概述熟悉元件的基本一般資訊、特性和特點，以及其符合產業標準和法規的情況。
數據手冊
數據手冊透過下載元件的規格表來全面了解電子元件。這份 PDF 文件包含了所有必要的詳細資訊，如產品概述、特點、規格、評級、圖表、應用等等。
修訂日期:
數據表預覽
封裝
封裝元件的包裝資訊提供了產品尺寸、重量和包裝等重要細節。這有助於工程師判斷產品是否符合其需求和期望。
您必須登錄才能查看受限信息。
Supplier Package
Pin Count
PCB
Tab
Package Length (mm)
Package Width (mm)
Package Height (mm)
Pin Pitch (mm)
Package Diameter (mm)
Mounting
Package Outline
參數
參數參數資訊顯示了元件的重要特性和性能指標，這有助於工程師和供應鏈經理比較和選擇最適合他們應用和需求的電子元件。
您必須登錄才能查看受限信息。
生產線
Maximum Storage Temperature
Minimum Endurance
Supplier Temperature Grade
Minimum Storage Temperature
Simultaneous Read/Write Support
Erase Suspend/Resume Modes Support
ECC Support
MMC Version
OE Access Time
Page Read Current
Program Current
Page Size
Programmability
Sector Size
Density in Bits
Command Compatible
Bank Size
Number of Banks
Support of Page Mode
Maximum Page Access Time
Support of Common Flash Interface
Process Technology
Tradename
Maximum Cycle Time
I/O Mode
Density
Cell Type
Interface Type
Timing Type
Number of Words
Number of Bits per Word
Maximum Operating Frequency
Maximum Access Time
Maximum Erase Time
Maximum Programming Time
Typical Operating Supply Voltage
Minimum Operating Supply Voltage
Maximum Operating Supply Voltage
Architecture
Programming Voltage
Boot Block
Location of Boot Block
Maximum Operating Current
Block Organization
Address Bus Width
Minimum Operating Temperature
Maximum Operating Temperature
