AEM
MHI0805C3N3SB
Inductor High Frequency Chip Multi-Layer 0.0033uH 0.3nH 100MHz 13Q-Factor Ceramic 0.3A 0.13Ohm DCR 0805 Bulk
Inductance0.0033uH
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Technical Specifications
AEM MHI0805C3N3SB technical specifications.
General
| Type | High Frequency Chip |
| Technology | Multi-Layer |
| Core Material | Ceramic |
| Inductance | 0.0033uH |
| Tolerance | 0.3nH |
| Inductance Test Frequency | 100MHz |
| Maximum DC Current | 0.3A |
| Max DC Resistance | 0.13Ohm |
| Minimum Quality Factor | 13(Typ) |
| Minimum Self Resonant Frequency | 6000MHz |
| Case Size | 0805 |
| Product Length | 2.2mm |
| Height | 1.1mm |
| Product Depth | 1.4mm |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
AEM MHI0805C3N3SB Datasheet
Download the complete datasheet for AEM MHI0805C3N3SB to view detailed technical specifications.
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