PackageLFCSP EP
MountingSurface Mount
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Technical Specifications
Analog Devices AD9559BCPZ technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
CSP
Package/Case
LFCSP EP
Package Description
Lead Frame Chip Scale Package, Exposed Pad
Lead Shape
No Lead
Pin Count
72
PCB
72
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
0.83
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220VNND-4
Number of Outputs per Chip
4
Input Logic Level
LVDS|LVPECL
Output Logic Level
CMOS|HSTL|LVDS
Clock Input Frequency
0.002 to 1250MHz
Min Operating Supply Voltage
1.71/3.135V
Max Operating Supply Voltage
1.89/3.465V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices AD9559BCPZ Datasheet
Download the complete datasheet for Analog Devices AD9559BCPZ to view detailed technical specifications.
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