Dual 8:1 analog multiplexer, featuring 28 pins in a Thin Shrink Small Outline Package (TSSOP) with gull-wing leads for surface mounting. This semiconductor IC offers 16 inputs and 2 outputs, with an 8:1 multiplexer architecture per channel. Operating across a temperature range of -40°C to 125°C, it provides a maximum on-resistance between 400 and 1000 Ohms. The lead-frame SMT package is constructed from plastic, measuring 9.7mm in length, 4.4mm in width, and a maximum height of 1.05mm, with a 0.65mm pin pitch.
PackageTSSOP
MountingSurface Mount
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Technical Specifications
Analog Devices ADG5207BRUZ-RL7 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
9.7
Package Width (mm)
4.4
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AE
Type
Analog Multiplexer
Configuration
Dual 8:1
Number of Channels per Chip
2
Multiplexer Architecture
8:1
Number of Inputs per Chip
16
Number of Outputs per Chip
2
Maximum On Resistance Range
400 to 1000Ohm
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices ADG5207BRUZ-RL7 Datasheet
Download the complete datasheet for Analog Devices ADG5207BRUZ-RL7 to view detailed technical specifications.
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