PackageLFCSP EP
MountingSurface Mount
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Technical Specifications
Analog Devices ADN2526ACPZ technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
CSP
Package/Case
LFCSP EP
Package Description
Lead Frame Chip Scale Package, Exposed Pad
Lead Shape
No Lead
Pin Count
16
PCB
16
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.83
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220VEED-4
Data Rate
11.3Gbps
Number of Channels per Chip
1
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
3.6V
Min Operating Supply Voltage
3V
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices ADN2526ACPZ Datasheet
Download the complete datasheet for Analog Devices ADN2526ACPZ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.