PackageLFCSP EP
MountingSurface Mount
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Technical Specifications
Analog Devices ADN2531ACPZ-R7 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | CSP |
| Package/Case | LFCSP EP |
| Package Description | Lead Frame Chip Scale Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 3 |
| Package Width (mm) | 3 |
| Package Height (mm) | 0.73 |
| Mounting | Surface Mount |
| Jedec | MO-220WEED-6 |
| Type | VCSEL/FP/DFB |
| Data Rate | 11.3Gbps |
| Number of Channels per Chip | 1 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Supply Voltage | 3V |
| Typical Operating Supply Voltage | 3.3V |
Compliance
| Cage Code | 24355 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Analog Devices ADN2531ACPZ-R7 Datasheet
Download the complete datasheet for Analog Devices ADN2531ACPZ-R7 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.