PackageLFCSP EP
MountingSurface Mount
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Technical Specifications
Analog Devices ADRF6601APCZ technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
CSP
Package/Case
LFCSP EP
Package Description
Lead Frame Chip Scale Package, Exposed Pad
Lead Shape
No Lead
Pin Count
40
PCB
40
Package Length (mm)
6
Package Width (mm)
6
Package Height (mm)
0.83
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220VJJD-2
Maximum Input Frequency
3100MHz
Maximum Output Frequency
500(Typ)MHz
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Min Operating Supply Voltage
4.75V
Typical Operating Supply Voltage
5V
Max Operating Supply Voltage
5.25V
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices ADRF6601APCZ Datasheet
Download the complete datasheet for Analog Devices ADRF6601APCZ to view detailed technical specifications.
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