PackageCSP-BGA
MountingSurface Mount
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Technical Specifications
Analog Devices ADSP-21364BBCy1AA technical specifications.
General
Package/Case
CSP-BGA
Lead Shape
Ball
Pin Count
136
PCB
136
Package Length (mm)
12
Package Width (mm)
12
Package Height (mm)
1.21
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Data Bus Width
32|40bit
Instruction Set Architecture
Super Harvard
Numeric and Arithmetic Format
Floating-Point
Program Memory Type
ROM
Program Memory Size
512KB
RAM Size
384KB
Maximum Speed
333MHz
Device Input Clock Speed
333MHz
Typical Operating Supply Voltage
1.2|3.3V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
24355
EU RoHS
No
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices ADSP-21364BBCy1AA Datasheet
Download the complete datasheet for Analog Devices ADSP-21364BBCy1AA to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.