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Technical Specifications
Analog Devices AMP-01BX/883 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
CDIP
Package Description
Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
18
PCB
18
Package Length (mm)
24.38(Max)
Package Width (mm)
7.87(Max)
Package Height (mm)
3.56(Max)
Package Material
Ceramic
Mounting
Through Hole
Number of Channels per Chip
1
Maximum Input Offset Voltage
0.1@±15VmV
Maximum Input Bias Current
0.006@±15VuA
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Maximum Dual Supply Voltage
±18V
Compliance
Cage Code
24355
HTS Code
8542330001
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Analog Devices AMP-01BX/883 Datasheet
Download the complete datasheet for Analog Devices AMP-01BX/883 to view detailed technical specifications.
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