PackageQFN EP
MountingSurface Mount
Quick Jump:
Technical Specifications
Analog Devices HMC648LP6E technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | QFN EP |
| Package Description | Quad Flat No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 6.1(Max) |
| Package Width (mm) | 6.1(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.71(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Module/IC Classification | IC |
| Type | Digital |
| Maximum Phase Shift Range | 360° |
| Number of Bits | 6 |
| Frequency Range | 2900 to 3900MHz |
| Maximum Insertion Loss | 8dB |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 24355 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Analog Devices HMC648LP6E Datasheet
Download the complete datasheet for Analog Devices HMC648LP6E to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.