PackageCQFN EP
MountingSurface Mount
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Technical Specifications
Analog Devices HMC819LC5 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
CQFN EP
Package Description
Ceramic Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
32
PCB
32
Package Length (mm)
5
Package Width (mm)
5
Package Height (mm)
1.12(Max)
Seated Plane Height (mm)
1.12(Max)
Pin Pitch (mm)
0.56(Max)
Package Material
Ceramic
Mounting
Surface Mount
Maximum Input Frequency
23700MHz
Maximum Output Frequency
3750MHz
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Typical Operating Supply Voltage
5V
Maximum Power Dissipation
2240mW
Maximum Conversion Gain
17dB
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices HMC819LC5 Datasheet
Download the complete datasheet for Analog Devices HMC819LC5 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.