PackageCLLCC EP
MountingSurface Mount
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Technical Specifications
Analog Devices HMC875LC3C technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | LLCC |
| Package/Case | CLLCC EP |
| Package Description | Ceramic Leadless Chip Carrier, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 2.9 |
| Package Width (mm) | 2.9 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 0.8 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Ceramic |
| Mounting | Surface Mount |
| Package Orientation | Yes |
| Package Orientation Marking Type | Dot |
| Manufacturer Type | Clocked Comparator |
| Number of Channels per Chip | 1 |
| Typical PSRR | 35dB |
| Maximum Input Offset Voltage | 5(Typ)@3.3V/-3VmV |
| Maximum Input Bias Current | 15(Typ)@3.3V/-3VuA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 24355 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Analog Devices HMC875LC3C Datasheet
Download the complete datasheet for Analog Devices HMC875LC3C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.