PackageDFN EP
MountingSurface Mount
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Technical Specifications
Analog Devices LT4275BIDD#PBF technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
DFN
Package/Case
DFN EP
Package Description
Dual Flat Package No Lead, Exposed Pad
Lead Shape
No Lead
Pin Count
10
PCB
10
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.75(Max)
Seated Plane Height (mm)
0.75
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-229WEED-2
Standard Supported
IEEE802.3af/IEEE802.3at
Maximum Input Voltage
60V
Minimum Input Voltage
23V
Maximum Output Power
25.5W
Maximum Duty Cycle
50(Typ)%
Programmability
Yes
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542310000
ECCN
EAR99
Automotive
Yes
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices LT4275BIDD#PBF Datasheet
Download the complete datasheet for Analog Devices LT4275BIDD#PBF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.