PackageWLCSP
MountingSurface Mount
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Technical Specifications
Analog Devices SSM2519ACBZ-R7 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
12
PCB
12
Package Length (mm)
1.67
Package Width (mm)
1.42
Package Height (mm)
0.3
Seated Plane Height (mm)
0.5
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Function
Speaker
Amplifier Type
Class-D
Typical PSRR
82dB
Input Signal Type
Single
Output Signal Type
Differential
Output Type
1-Channel Mono
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices SSM2519ACBZ-R7 Datasheet
Download the complete datasheet for Analog Devices SSM2519ACBZ-R7 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.