
Black, fiberglass and silicone thermal interface material designed for gap filling applications. This rectangular pad features a 0.08-inch thickness and dimensions of 8 inches by 16 inches, offering a 1500 W/mK thermal conductivity. Ideal for managing heat in electronic assemblies, it provides excellent dielectric strength and conformability.
Bergquist GP1500-0.080-02-0816 technical specifications.
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