Bourns
4820P-2-561
Res Thick Film NET 560 Ohm 2% 1.6W ±100ppm/C BUS Molded 20-Pin SOM Gull Wing SMD T/R
PackageSOIC
Resistance560R
MountingSurface Mount
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Technical Specifications
Bourns 4820P-2-561 technical specifications.
General
Package/Case
SOIC
Circuit Type
Bussed
Depth
7.62mm
Height
0.085inch
Lead Pitch
1.27mm
Length
0.54inch
Max Operating Temperature
125°C
Military Standard
Not
Min Operating Temperature
-55°C
Mount
Surface Mount
Number of Resistors
19
Package Quantity
2000
Packaging
Tape and Reel
Power Per Element
80mW
Resistance
560R
RoHS Compliant
No
Series
4800P
Technology
THICK FILM
Terminal Pitch
1.27mm
Termination
SMD/SMT
Tolerance
2%
Width
0.22inch
Compliance
RoHS
Not Compliant
Datasheet
Bourns 4820P-2-561 Datasheet
Download the complete datasheet for Bourns 4820P-2-561 to view detailed technical specifications.
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