333 MHz MIPS32 System-on-Chip (SoC) with a 399-pin BGA package, measuring 17x17mm. This plastic ball grid array device features a ROMLess program memory type and operates at a typical supply voltage of 1.2V. It offers 48 programmable I/Os and supports I2S, SMBus, SPI, UART, and USB interfaces. Designed for digital media adapter applications, it operates within a temperature range of -40°C to 100°C.
PackageBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Broadcom AU1200-333MGI technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
399
PCB
399
Package Length (mm)
17
Package Width (mm)
17
Package Material
Plastic
Mounting
Surface Mount
Family Name
Au1200
Device Core
MIPS32
Maximum Clock Rate
333MHz
Program Memory Type
ROMLess
Maximum Speed
333MHz
Type
System-On-Chip
Processing Unit
Microprocessor
Typical Operating Supply Voltage
1.2V
Number of Programmable I/Os
48
Application
Digital Media Adapter
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Interface Type
I2S/SMBus/SPI/UART/USB
Programmability
No
Compliance
Cage Code
50434
EU RoHS
No
HTS Code
8542310001
Schedule B
8542390000
ECCN
5A992.c
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Broadcom AU1200-333MGI Datasheet
Download the complete datasheet for Broadcom AU1200-333MGI to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.