333 MHz MIPS32 System-On-Chip (SoC) with 399-pin BGA package. This plastic ball grid array component features a 17mm x 17mm footprint and supports surface mount technology. It offers 2x Ethernet (10Mbps/100Mbps), 1x USB, and 2x UART interfaces, with 39 programmable I/Os. Designed for multimedia applications, it operates at a typical supply voltage of 1.5V.
PackageBGA
MountingSurface Mount
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Technical Specifications
Broadcom AU1500-333MBD technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
399
PCB
399
Package Length (mm)
17
Package Width (mm)
17
Package Material
Plastic
Mounting
Surface Mount
Family Name
Au1500
Device Core
MIPS32
Maximum Clock Rate
333MHz
Program Memory Type
ROMLess
Maximum Speed
333MHz
Type
System-On-Chip
Processing Unit
Microprocessor
Typical Operating Supply Voltage
1.5V
Number of Programmable I/Os
39
Application
Multimedia
Interface Type
Ethernet/UART/USB
SPI
0
I2C
0
I2S
0
UART
2
USB
1
USART
0
CAN
0
Ethernet
2
Programmability
No
Ethernet Speed
10Mbps/100Mbps
Compliance
Cage Code
50434
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542390000
ECCN
5A991.b
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Broadcom AU1500-333MBD Datasheet
Download the complete datasheet for Broadcom AU1500-333MBD to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.