PackageFBGA
MountingSurface Mount
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Technical Specifications
Broadcom BCM8705LAKFBG technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Material
Plastic
Mounting
Surface Mount
Number of Channels per Chip
1
Maximum Data Rate
10.5188Gbps
PHY Line Side Interface
No
JTAG Support
Yes
Standard Supported
IEEE 802.3
Typical Data Rate
9953/10312.5/10518.8Mbps
Integrated CDR
Yes
Ethernet Speed
10Gbps
Overhead Octet Support
No
Compliance
Cage Code
50434
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Broadcom BCM8705LAKFBG Datasheet
Download the complete datasheet for Broadcom BCM8705LAKFBG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.