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Technical Specifications
Broadcom CYNCP80192-BGXC technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
388
PCB
388
Package Length (mm)
35
Package Width (mm)
35
Package Height (mm)
1.73
Seated Plane Height (mm)
2.33(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Core Operating Frequency
100MHz
Typical Operating Supply Voltage
2.5V
Min Operating Supply Voltage
2.37V
Max Operating Supply Voltage
2.63V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
50434
HTS Code
8542390001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Broadcom CYNCP80192-BGXC Datasheet
Download the complete datasheet for Broadcom CYNCP80192-BGXC to view detailed technical specifications.
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