This BGA Telecom IC is a specialized integrated circuit with 388 pins, measuring 35mm in length and width, and 1.73mm in height. It features a plastic ball grid array package and is designed for surface mount applications. The IC is suitable for use in a variety of telecom applications, with a package material of plastic and a seated plane height of up to 2.33mm.
PackageBGA
MountingSurface Mount
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Technical Specifications
Broadcom CYNSE70128-100BGXCT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 388 |
| PCB | 388 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.33(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | 50434 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Broadcom CYNSE70128-100BGXCT Datasheet
Download the complete datasheet for Broadcom CYNSE70128-100BGXCT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.