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Technical Specifications
Broadcom CYNSE70128-83BGXI technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
388
PCB
388
Package Length (mm)
35
Package Width (mm)
35
Package Height (mm)
1.73
Seated Plane Height (mm)
2.33(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Category
Network Search Engine
Max Operating Supply Voltage
1.733V
Min Operating Supply Voltage
1.425V
Power Supply Type
Analog
Typical Supply Current
600mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
50434
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Broadcom CYNSE70128-83BGXI Datasheet
Download the complete datasheet for Broadcom CYNSE70128-83BGXI to view detailed technical specifications.
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