Chip Quik TC3 is an non-curing, flowable, white thermally conductive heat sink compound. It is designed to provide high thermal conductivity and low bleed with high temperature stability. It features a high dielectric constant and is electrically non-conductive, making it suitable for managing heat in electronic components without risk of short circuits.
Temp Range-40 to 150°C
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Technical Specifications
Chip Quik TC3-10G technical specifications.
General
| Thermal Conductivity | 3W/mK |
| Thermal Resistance | 0.02°C*cm²/W |
| Operating Temperature Range | -40 to 150°C |
| Density | 2.5g/cc |
| Volume | 3cc |
| Weight | 10g |
| Dielectric Constant | 4.5 |
| Dielectric Strength | 400V/mil |
| Viscosity | 510000mPa·s |
Compliance
| RoHS | RoHS 3 Compliant |
| REACH | Compliant |
| Lead Free | Lead-Free |
Datasheet
Chip Quik TC3-10G Datasheet
Download the complete datasheet for Chip Quik TC3-10G to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.