Passive heat sink designed for BGA packages, featuring a thin, square profile with fins. Constructed from Aluminum 6063, this heat sink offers a natural thermal resistance of 4°C/W and a thermal resistance of 4°C/W at 100 LFM forced air flow. It includes adhesive mounting for secure attachment and a black anodized finish for enhanced durability and heat dissipation. Measuring 19mm in length, 19mm in width, and 12.7mm in height, this lead-free component is suitable for ASIC cooling applications.
PackageBGA
MountingAdhesive
Quick Jump:
Technical Specifications
CTS APF19-19-13CB/A01 technical specifications.
General
| Package/Case | BGA |
| Color | Black |
| Depth | 19mm |
| Finish | Anodized |
| Height | 12.7mm |
| Lead Free | Lead Free |
| Length | 19mm |
| Material | Aluminium |
| Mount | Adhesive |
| Natural Thermal Resistance | 4°C/W |
| Package Cooled | ASIC |
| Packaging | Rail/Tube |
| Radiation Hardening | No |
| Series | APF |
| Shape | Square, Fins |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 4°C/W |
| Type | Passive |
| Width | 19mm |
Compliance
| RoHS | Compliant |
Datasheet
CTS APF19-19-13CB/A01 Datasheet
Download the complete datasheet for CTS APF19-19-13CB/A01 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
