Passive heat sink designed for BGA packages, featuring a thin, square profile with fins. Constructed from Aluminum 6063, this heat sink offers a natural thermal resistance of 4°C/W and a thermal resistance of 4°C/W at 100 LFM forced air flow. It includes adhesive mounting for secure attachment and a black anodized finish for enhanced durability and heat dissipation. Measuring 19mm in length, 19mm in width, and 12.7mm in height, this lead-free component is suitable for ASIC cooling applications.
PackageBGA
MountingAdhesive
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Technical Specifications
CTS APF19-19-13CB/A01 technical specifications.
General
Package/Case
BGA
Color
Black
Depth
19mm
Finish
Anodized
Height
12.7mm
Lead Free
Lead Free
Length
19mm
Material
Aluminium
Mount
Adhesive
Natural Thermal Resistance
4°C/W
Package Cooled
ASIC
Packaging
Rail/Tube
Radiation Hardening
No
Series
APF
Shape
Square, Fins
Thermal Resistance @ Forced Air Flow (100 LFM)
4°C/W
Type
Passive
Width
19mm
Compliance
RoHS
Compliant
Datasheet
CTS APF19-19-13CB/A01 Datasheet
Download the complete datasheet for CTS APF19-19-13CB/A01 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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