Forged aluminum heat sink for BGA packages, featuring a black anodized finish. This square, finned heat sink measures 30mm x 30mm x 6.3mm and utilizes adhesive mounting for ASIC applications. Achieves a thermal resistance of 4.4°C/W at 100 LFM forced air flow. Lead-free construction.
PackageBGA
MountingAdhesive
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Technical Specifications
CTS APF30-30-06CB/A01 technical specifications.
General
| Package/Case | BGA |
| Color | Black |
| Finish | Anodized |
| Height | 6.3mm |
| Lead Free | Lead Free |
| Length | 30mm |
| Material | Aluminium |
| Mount | Adhesive |
| Package Cooled | ASIC |
| Package Quantity | 300 |
| Series | APF |
| Shape | Square, Fins |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 4.4°C/W |
| Width | 30mm |
Compliance
| RoHS | Compliant |
Datasheet
CTS APF30-30-06CB/A01 Datasheet
Download the complete datasheet for CTS APF30-30-06CB/A01 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.